Backplane PCB
Large, thick circuit boards that connect cards and modules in communication and computing systems.
Backplane PCB with ShinePCB
Backplanes combine high layer counts, large formats and many connectors. We review stack-up, thickness, press-fit holes and back drilling needs, and confirm feasibility for each design.
- Stack-up and overall thickness
- Press-fit hole requirements
- Back drilling for high-speed channels
- Flatness and handling for large boards
Capability and certificates
| Positioning | High Layer Count / Back Drilling | |
|---|---|---|
| Standard / prototype | Advanced / mass production | |
| Backplane PCB | Up to 48L; Back Drilling | Up to 48L; Back Drilling |
Related certificates
- ISO 9001:2015133628
- UL 796E466435
- IECQ QC 080000IECQ-H NQAGB 25.0038
- CQCCQC20001245054
- IATF 16949:2016NQA T14016 / IATF 0498905
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
Backplane-related limits
| Parameter | Prototype | Mass production |
|---|---|---|
| Layer count | Up to 48L | Up to 48L |
| Back drilling | Supported | Supported |
| Rigid — Finished board thickness | 0.2–15.0 mm | 0.3–7.0 mm |
| Rigid — Max aspect ratio | 35:1 | 30:1 |
| Max backplane size | Confirmed per project | Confirmed per project |
Source: ShinePCB capability workbook (navigation overview and 2025 rigid values). Prototype and mass-production values are listed separately and are not interchangeable. Every value is confirmed against your files, the selected material and the assigned facility during engineering review.
Typical applications
Telecom and data center chassis
Test systems
Industrial computing racks
From prototype to production
Every order follows the same controlled sequence. Prototype and production requirements are reviewed separately.
File review
Gerber or ODB++, drill data, drawing and quantities are checked for completeness.
Engineering questions
Open points on manufacturability, materials or special processes are sent before quotation.
Stack-up and material
Construction, laminate and finish are confirmed with you and written into the order.
Fabrication
The order is released to the facility whose process and qualification fit the requirements.
Inspection and test
Inspection and electrical test follow the methods agreed for your order.
Packing and delivery
Boards are packed and shipped under the confirmed delivery terms.
What to send for a PCB review
Start with the details you have — engineering will request anything else needed for the review.
Files and details for a PCB review
- Gerber (RS-274X) or ODB++ data with drill files
- Fabrication drawing with material, thickness and finish
- Stack-up and impedance targets, if any
- Quantity for prototype and for production
- Special requirements such as IPC class, testing or packaging
Technical files stay private
Customer Gerber, BOM and design data are managed under an ISO/IEC 27001 information security system and shared only within your project.
Backplane PCB FAQs
Do you review press-fit requirements?
Yes. Share the connector specifications and hole requirements for review.
Is back drilling required?
It depends on your data rates and via stubs. Engineering discusses it during review.
